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Quality EMI RFI Shielding Can Metal Stamping Cover with ±0.05mm Precision Tolerance and 0.2mm-1.0mm Thickness Range for SMT Assembly factory
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Quality EMI RFI Shielding Can Metal Stamping Cover with ±0.05mm Precision Tolerance and 0.2mm-1.0mm Thickness Range for SMT Assembly factory
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EMI RFI Shielding Can Metal Stamping Cover with ±0.05mm Precision Tolerance and 0.2mm-1.0mm Thickness Range for SMT Assembly

Product Summary

Precision EMI/RFI shielding cans and SMT shield frames for electronic circuit board applications. Tin-plated 0.2mm-1mm thin gauge stamping with tight tolerance for PCB surface mount assembly.

Product Custom Attributes

Material:
Tin Plated Steel, Nickel Silver, Copper Alloy
Thickness Range:
0.2mm - 1.0mm
Process:
Fine Blanking Progressive Die Stamping
Tolerance:
±0.05mm
Surface Plating:
Bright Tin, Matte Tin, Nickel
Application:
PCB SMT Assembly, RF Module, Wireless Device
Highlight:

Precision Tolerance EMI RFI Shielding Can

,

0.2mm-1.0mm Thickness Metal Stamping Cover

,

SMT Compatible Shield Frame

Basic Properties

Place of Origin:
Guangdong, China
Brand Name:
WNRLN
Certification:
ISO 9001:2015, RoHS Compliant
Model Number:
EMS-TP-S01

Trading Properties

Minimum Order Quantity:
500 Pieces
Price:
USD 0.05-1.50 / Piece
Packaging Details:
Anti-static tray + vacuum sealed bag, export-grade carton
Delivery Time:
10-15 working days for production
Payment Terms:
T/T, L/C, PayPal, Western Union
Supply Ability:
2000000 Pieces per Month

Product Description

EMI/RFI Shielding Can Metal Stamping

The EMI Shielding Can Metal Stamping provides critical electromagnetic interference protection for sensitive electronic circuits. Manufactured using fine blanking progressive die technology with ±0.05mm precision tolerance, these thin-gauge stamped parts are designed for automated SMT pick-and-place assembly.

Available in tin-plated steel, nickel silver, and copper alloy materials with thickness from 0.2mm to 1.0mm. Our shielding solutions cover a wide range of electronic applications from consumer devices to industrial and automotive electronics requiring RoHS-compliant EMI protection.

Key Features

  • Fine Blanking Precision: ±0.05mm tolerance for consistent PCB fitment
  • Thin Gauge Expertise: 0.2mm-1.0mm ultra-thin material stamping capability
  • SMT Compatible: Designed for automated pick-and-place assembly with flat coplanarity
  • Multiple Plating Options: Bright tin, matte tin, and nickel surface finishes
  • RoHS Compliant: Lead-free materials and plating meeting global environmental standards

Technical Specifications

AttributeSpecification
MaterialTin Plated Steel, Nickel Silver, Copper Alloy
Thickness Range0.2mm - 1.0mm
ProcessFine Blanking Progressive Die
Tolerance±0.05mm
Surface PlatingBright Tin, Matte Tin, Nickel
SolderabilityPer J-STD-002 Standard

Applications

  • Smartphone and tablet PCB shielding
  • WiFi and Bluetooth module RF cans
  • Automotive ECU electronic shielding
  • Medical device circuit protection
  • IoT sensor module EMI enclosures

FAQ

Q: Can you produce two-piece shield frame and cover sets?
A: Yes, we manufacture both shield frames (soldered to PCB) and removable snap-on covers with precise interlocking features.

Q: What flatness tolerance can you guarantee?
A: We achieve coplanarity of 0.1mm maximum across the entire shield footprint to ensure reliable SMT placement.

Q: Do you offer tape and reel packaging for SMT assembly?
A: Yes, we provide tape and reel packaging compatible with standard SMT feeder systems for automated assembly lines.

Contact Our Experts And Get A Free Consultation!

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